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Silicon Carbide Powder 98% Sic Silicon Carbide


  • Materia:Sic
  • Mole densum;1.45-1.56g/cm3
  • densi Ture;3.12 g/cm3
  • Magnitudo:F12-F220
  • Color:nigreos
  • Figura:GLAREA GLAREA
  • SiC Content:>98%
  • Consuetudinem:Polishing.Grinding et Sandblasting
  • Crystalsystem:Sexangulus
  • Product Detail

    Applications

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    Silicon Carbide

    Propter raritatem moissanite naturalis, maxime carbida pii synthetica est.Usus est ut abrasive, et recentius ut semiconductor et adamas simulans gemmae qualitatis.Processus fabricandi simplicissimus est arenam silicam et carbonem in Acheson graphite resistentia electrici fornacem calidissimam miscere, inter 1,600 °C (2,910 °F) et 2,500 °C (4,530 °F).Praeclara SiO2 particulae in materia plantae (eg rice siliquis) ad SiC converti possunt calefaciendo in excessu carbonis ex materia organica.Fumus silica, qui gignendo metallum siliconis et ferrosilicon gignit, verti potest etiam in SiC calefaciendo graphite ad 1,500 °C (2,730 °F).

     

    Silicon Carbide Size Available

    F12-F1200, P12-P2500

    0-1mm, 1-3mm, 6/10, 10/18, 200mesh, 325mesh

    Aliae specificationes speciales suppleri possunt in rogatu.

    Silicon Carbide Chemical Compositio (%)

    Grit Sic FC Fe2O3
    F12-F90 ≥98.50 <0.20 ≤0.60
    F100-F150 ≥98.00 <0.30 ≤0.80
    F180-F220 ≥97.00 <0.30 ≤1.20
    F230-F400 ≥96.00 <0.40 ≤1.20
    F500-F800 ≥95.00 <0.40 ≤1.20
    F1000-F1200 ≥93.00 <0.50 ≤1.20
    P12-P90 ≥98.50 <0.20 ≤0.60
    P100-P150 ≥98.00 <0.30 ≤0.80
    P180-P220 ≥97.00 <0.30 ≤1.20
    P230-P500 ≥96.00 <0.40 ≤1.20
    P600-P1500 ≥95.00 <0.40 ≤1.20
    P2000-P2500 ≥93.00 <0.50 ≤1.20

    Silicon Carbide Physical Index

    Grits mole Density
    (g/cm3)
    Princeps Density
    (g/cm3)
    Grits mole Density
    (g/cm3)
    Princeps Density
    (g/cm3)
    F16 ~ F24 1.42~1.50 ≥1.50 F100 1.36~1.45 ≥1.45
    F30 ~ F40 1.42~1.50 ≥1.50 F120 1.34~1.43 ≥1.43
    F46 ~ F54 1.43~1.51 ≥1.51 F150 1.32~1.41 ≥1.41
    F60 ~ F70 1.40~1.48 ≥1.48 F180 1.31~1.40 ≥1.40
    F80 1.38~1.46 ≥1.46 F220 1.31~1.40 ≥1.40
    F90 1.38~1.45 ≥1.45      

     


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  • B-SIC

    1. Molere et polire: materiam removere, superficies delenire, et superficiem desideratam consequi finit
    2. Abrasives obductis: sandpaper, abrasive cingula et disc
    3. Industry semiconductor: adhibetur ad scillationes et aleas silicones ingots et assequendis praecisis incisionibus cum minimo damno materiali et superficiali damno.
    4. Refractoriis et Ceramicis uasis, fornacibus, et aliis elementis summus temperatus.
    5. Metallurgical Applications
    6. Filum Sawing
    7. Abrasive Blasting: superficies purgatio, engraving, ac praeparatio in industriis ut constructione, fabricatione metalli, et autocinetis.
    8. Exacutio Diamond: formans, stridor, et superficies adamantinas poliendo ad augendam eorum candorem et proprietates opticas.
    9. Applicationes fundatae: sandblating, praeparatio superficiei et dejectiones metallicae purgatio.

     

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